Today's SMD assembly lines only use taped goods in order to save valuable feeder space. The taping for SMD components is primarily based on the standard DIN ENIEC 60286-3 or according to your wishes.
Depending on the quantity of components, manual or automatic blister tape machines are used. For ESDs, we only use dissipative blister tapes (carrier tape) and sealing tapes (cover tape), plastic rollers protected against electrostatic discharge and shielding, airtight DRYLOK bags. This always ensures that electrostatically sensitive components are packed in conductive film. Shipping is of course possible in vacuum packaging.
The processing steps are fully documented from the goods receipt to the time when your components leave our house. We offer you our free additional service "Traceability", which our customers appreciate and enjoy.
Quality control and quality assurance are aimed at the ISO 9001: 2015 and ultimately occurs with each individual component. Whether by visual inspection or by vision. 100% control by people, qualified employees and machines, optical control via camera system.
Examples of SMD components and housing shapes that can be taped:
- ICs of all kinds
- Ceramic capacitors
- Contact springs
- Solder sleeves
- Solder pads
- SMD LEDs
- Do the washing up
- And much more.
- D - PAK / D2 - PAK
- PLCC20 - 84
- QFP 05 x 05 - 28 x 28
- SO / SOIC / SOJ / SOMC / SOP / SOT / SSOP connections 8 - 64
- TSOP / TSSOP / VSO ports 8 - 64
- And much more.
The advantages of pay belt service are obvious: you save time-consuming work steps and tools. That means time and money. To find out whether the component can be taped, we need a component drawing in advance. Ideally, the data sheet from the component manufacturer + and, if desired, Pin1 variant / component direction in the belt. Here it goes to Request.